메뉴 바로가기 본문 바로가기

Future industry

Optimal Reaction through CHEMistry

Creating future through challenges

2029

Beyond the Best
Our challenges and perseverance will continue.

R&D Road Map

2028

  • PCB, Display, Semiconductor field
    Material specialized Company

2027

  • Entering Special Materials Business

    • Display
    • Semiconductor

2026

  • 1. Non-Etcing Products

    • Glass plating / Laminated products (A·P) /
      Peeling agents

  • 2. Entering Non-PCB Industry

    • TSV Plating
    • PSR & Peeling agents for Display
  • 3. ORC ECO Project Ⅱ

    • HCHO Free E’less Plating
    • Non-Amine type Peeling Agent

2025

  • 1. Enhance Electric Copper line-up

    • Normal / High-Speed / Pattern / Pulse
  • 2. Development and Expansion of New Technology

    • Various Plating Materials: Interposer / TGV / Glass
  • 3. ORC ECO Product I

    • Ni Free E'less Plating
    • S-Free D/F Acid cleaner