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Development history

Optimal Reaction through CHEMistry

We succeeded in developing technologies for localization with entirely proprietary technology in a market previously dominated by foreign companies. We are now the no. 1 company in Korea in the PCB electroless copper plating market and are expanding into the global ORCHEM.

2024

  • Advancing Via Fill Plating Technology
  • Localization of fcBGA Vertical Chemical Building

2023

  • Development of Long-Life Catalysts

2022

  • Localization of Pattern Fill for PKG

2020

  • Vertical E'less Cu Plating for PKG SAP Process

2019

  • Via Hole Eletro Copper Fill Plating

2018

  • Dedicated E'less Cu Plating for Hyper Annealed Cu

2017

  • Horizontal E'less Cu Plating for PKG

2016

  • Alkali Pre-dip for E'less Cu Plating Catalyst Pre-treatment

2015

  • 50% improvement in PKG foreign matter defects and 30% reduction in cost (World’s First Innovation!)

2013

  • Successful Localization of the Line for Horizontal Chemical Building (Ion/Colloidal Type)

2004

  • Started localization project for Horizontal Chemical Building (97% produced by foreign companies)

    97% share dominated by foreign companies (2004) ORCHEM now takes 50% share (2024)