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Chemicals

Optimal Reaction through CHEMistry

PCB Pre-processing
  • Packaging Inspection
  • Gold-plating
  • PSR
  • D/F
    Delamination
  • D/F
    Pre-treatment
  • Cathode
    Copper
  • Chemistry Building
  • Drill
  • Stacking
  • Disc
D/F Delamination

D/F Stripper

  • Etching agents by type
  • Constant peel rate ∙particle size
  • Low R-cost (for wastewater treatment)
  • Fine pattern and PKG processing available
  • Easily penetrates between fine pitches in dense circuits for rapid stripping
D/F Pre-treatment

Pre-treatment

  • Etching agents by type
    (H2SO4/H2O2, Nitric acid, Organic acid)
  • Versatile Use
    (Soft, Half, Flash&Quick)
Cathode Copper

Electrolytic Plating

  • Suitable for plating with a high aspect ratio
  • Excellent Throwing power

Pattern / Via Fill Plating

  • Excellent fill rates at low plating thicknesses
  • Stable additive analysis
  • Dimple Free
Chemistry Building

Desmear & E'less Cu Plating

  • Enhanced neutralizing conditioning
  • Adaptable for different line characteristics
  • Excellent hole lining coverage
  • Excellent P.I. film adhesion
  • Rigid ∙ Flexible
  • Horizontal and vertical lines available
Stacking

Stacking

  • Brown oxide
  • Applicable to additive and LDD processes
  • High share of the domestic oxide market
PCB Manufacturing Process
  • STEP 01

    Prepare CCLs

  • STEP 02

    Applying Dry Film

  • STEP 03

    Exposure

  • STEP 04

    After Exposure

  • STEP 05

    DFR phenomena

  • STEP 06

    Etching

  • STEP 07

    DFR Delamination

  • STEP 08

    Oxide

  • STEP 09

    Stacking

  • STEP 10

    Drill Process

  • STEP 11

    Chemical copper plating

  • STEP 12

    Electroplating